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VIAFINE is professional Rigid PCB Manufacturer. We can produce Rigid PCB where other cannot, Such as: 16 Layers Rigid PCB, 19OZ Heavy Copper PCB, HDI PCB, and so on.
VIAFINE is continuously innovating the technology improving our Rigid PCB Capability to meet customers High-Tech requirement with High-Density, High Multilayer, Greater Aspect Ratio, better Impedance Controlled product.
Our Rigid PCB Capabilities below:
| Item | Description | Techonical Data |
| 1 | Layers | 2-16 Layers |
| 2 | Max. Board Size | 864 x 610 mm (34" x 24") |
| 3 | Min. Board Thickness | 0.2mm (2 layers) / 0.4mm (4 layers) / 0.9mm(8 layers) / 1.2mm (10 layers) / 1.3mm (12 layers) / 1.5mm (14 layers) / 1.7mm (16 layers) / 1.8mm / 2.0 mm (18 layers) / 2.2mm (20 layers) / 2.4mm ( 22 layers) / 2.6mm (24 layers) |
| 4 | Max. Board Thickness | 315mil(8mm) |
| 5 | Max. Copper Thickness | 19oz/Inner Layer: 12oz/Outlayers |
| 6 | Min. Inner Line Width / Space | 4mil(0.1mm) / 4mil(0.1mm) |
| 7 | Min. Outer Line Width / Sapce | 4mil(0.1mm) / 3.5mil(0.089mm) |
| 8 | Min. Finish Hole Size | 6mil(0.15mm) |
| 9 | Max. Aspect ratio | 12:1 |
| 10 | Minimum via hole size and pad | via: dia. 0.2mm / pad: dia. 0.4mm ; HDI <0.10mm via |
| 11 | Minimum hole tolerance | ±0.05mm(NPTH), ±0.076mm(PTH) |
| 12 | Finished hole size tolerance(PTH) | ±2mil(0.05mm) |
| 13 | Finished hole size tolerance(NPTH) | ±1mil(0.025mm) |
| 14 | PTH hole copper thickness | mini 25um(1.0mil) |
| 15 | Hole Position Deviation | ±2mil(0.05mm) |
| 16 | Outline Tolerance | ±4mil(0.1mm) |
| 17 | S/M Pitch | 3mil(0.08mm) |
| 18 | Insulation Resistance | 1 × 1012Ω |
| 19 | Thermal Shock | 3 × 10Sec@288 ℃ |
| 20 | Warp and Twist | ≤0.5% |
| 21 | Peel Strengh | 1.4N / mm |
| 22 | Solder Mask Abrasion | ≥6H |
| 23 | Flammability | 94V - O |
| 24 | Impedance Control | ±5% |
| 25 | Mini Solder mask Opening |
0.05mm(2mil) |
| 25 | Mini Solder mask Opening |
0.05mm(2mil) |
| 26 | Mini solder mask coverage | 0.05mm(2mil) |
| 27 | Mini solder dam | 0.076mm(3mil) |
| 28 | Surface Finish Treatment | Flash gold (Electrolytic); Electroless nickel Immersion gold (Electroless Ni/Au); Organic Solderability Preservatives (OSP or Entek), Hot Air Leveling (=HAL-Tin/Lead); Hot Air Leveling (Lead- Free, RoHS); Carbon Ink, Peelable Mask, Gold Fingers (30μ"), Immersion Silver (3~10u"), Immersion Tin (0.6~1.2um). |
| 29 | G/F Au thickness | 0.76um max ( 30u” max ) |
| 30 | V-cut angle | 30° 45° 60° , tolerence +/- 5° |
| 31 | Mini V-cut board thickness | 0.8mm |
| 32 | V-cut remain thickness tolerance | ±0.1mm |
| 33 | Profiling mode | Routing & Punching |
| 34 | Profiling tolerance | ±0.1mm(4mil) |
| 35 | E-TEST voltage | 250 ± 5 V |
| 36 | Capacity | 60, 000 square feet (Month) |
ISO9001:2008, UL (E351742), Gold PCB SGS Test Report, HASL PCB SGS Test Report
How To PCB Quote
VIAFINE is a professional PCB Manufacturer, our service objective is "customer-oriented, fast, high-quality customer services". We provide 24-hour Quick Turn PCB service, 2-Hours reply engineering techniques questions, 2-Hour Quick PCB Quote.
Please send your detailed pcb requirements to tell us that we can produce a completely meet your needs printed circuit boards. If you do not know how to tell us about your needs, please carefully read our guidelines below.
If you need to PCB quote, Please contact us at
If you have any PCB engineering problem, Plase contact us at
Starting Requirements and Specifications
(1) Gerber data for all artwork layers
(2) Aperture list or lists for all layers
(3) Drill file in Gerber or Excellon format
(4) Drawings: Print should be hard copy or Gerber HPGL or DXF format
- Board dimensions and tolerances
- Datum points
- Overall thickness / Multi-layer detail stacking
- Hole sizes
(5) Special notes or "Read Me" file pertaining to:
- Color / type of solder-mask
- Color of silkscreen
- Plating finish (copper, nickel or gold)
- Dielectrics
- Controlled impedance
- Other special requirements or instructions
Standards and Specifications
- IPC-A-600 Acceptability of Printed Wiring Boards (default class 2)
- IPC-6011 Generic Performance Specification for Printed Wiring Boards
- IPC-6012 Qualification and Performance specs. (default class 2)
- IPC-TM-650 Test methods manual.
- IPC-SM-840 Qualification and Performance of permanent polymer coatings
- IPC-4101 Specification for base materials rigid / multi-layer
- MIL-PFR-55110 Military Performance and Specifications-Tucson
- IPC-6018 Microwave End Product Board Inspection and Test-Tucson
